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Temporary polymer bonding for the manufacturing of thin waf..:
Montméat, P.
;
Bally, L.
;
Dechamp, J.
..
Materials Science in Semiconductor Processing. 123 (2021) - p. 105550 , 2021
Link:
https://doi.org/10.1016/j.mssp.2020.105550
RT Journal T1 <Title>Temporary polymer bonding for the manufacturing of thin wafers: An innovative low temperature process</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mssp.2020.105550&Exemplar=1&LAN=DE A1 Montméat, P. A1 Bally, L. A1 Dechamp, J. A1 Enot, T. A1 Fournel, F. PB Elsevier BV YR 2021 SN 1369-8001 JF Materials Science in Semiconductor Processing VO 123 SP 105550 LK http://dx.doi.org/https://doi.org/10.1016/j.mssp.2020.105550 DO https://doi.org/10.1016/j.mssp.2020.105550 SF ELIB - SuUB Bremen
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