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Evaluation of correlation between fill factor and high mobi..:
Nishihara, Tappei
;
Kanai, Hiroki
;
Ohshita, Yoshio
...
Materials Science in Semiconductor Processing. 132 (2021) - p. 105887 , 2021
Link:
https://doi.org/10.1016/j.mssp.2021.105887
RT Journal T1 <Title>Evaluation of correlation between fill factor and high mobility transparent conductive oxide film deposition temperature in the silicon heterojunction solar cells</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mssp.2021.105887&Exemplar=1&LAN=DE A1 Nishihara, Tappei A1 Kanai, Hiroki A1 Ohshita, Yoshio A1 Nakamura, Kyotaro A1 Kamioka, Takefumi A1 Hara, Tomohiko A1 Yamaguchi, Seira A1 Koharada, Masato A1 Ogura, Atsushi PB Elsevier BV YR 2021 SN 1369-8001 JF Materials Science in Semiconductor Processing VO 132 SP 105887 LK http://dx.doi.org/https://doi.org/10.1016/j.mssp.2021.105887 DO https://doi.org/10.1016/j.mssp.2021.105887 SF ELIB - SuUB Bremen
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