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1 Ergebnisse
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Bonding strength enhancement of low temperature sintered Si..:
Cao, Peilin
;
Wang, Cong
;
Lin, Nai
...
Materials Science in Semiconductor Processing. 148 (2022) - p. 106802 , 2022
Link:
https://doi.org/10.1016/j.mssp.2022.106802
RT Journal T1 <Title>Bonding strength enhancement of low temperature sintered SiC power module by femtosecond laser induced micro/nanostructures</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mssp.2022.106802&Exemplar=1&LAN=DE A1 Cao, Peilin A1 Wang, Cong A1 Lin, Nai A1 Li, Shaohui A1 Zhang, Xiaofeng A1 Duan, Ji'an PB Elsevier BV YR 2022 SN 1369-8001 JF Materials Science in Semiconductor Processing VO 148 SP 106802 LK http://dx.doi.org/https://doi.org/10.1016/j.mssp.2022.106802 DO https://doi.org/10.1016/j.mssp.2022.106802 SF ELIB - SuUB Bremen
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