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1 Ergebnisse
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Longitudinal-torsional compound ultrasonic vibration end gr..:
Xu, Hailong
;
Yin, Zhen
;
Miao, Qing
...
Materials Science in Semiconductor Processing. 171 (2024) - p. 107990 , 2024
Link:
https://doi.org/10.1016/j.mssp.2023.107990
RT Journal T1 <Title>Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mssp.2023.107990&Exemplar=1&LAN=DE A1 Xu, Hailong A1 Yin, Zhen A1 Miao, Qing A1 Dai, Chenwei A1 Cheng, Jingcai A1 Li, Hua A1 Liang, Zhiqiang A1 Li, Zhanjie PB Elsevier BV YR 2024 SN 1369-8001 JF Materials Science in Semiconductor Processing VO 171 SP 107990 LK http://dx.doi.org/https://doi.org/10.1016/j.mssp.2023.107990 DO https://doi.org/10.1016/j.mssp.2023.107990 SF ELIB - SuUB Bremen
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