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1 Ergebnisse
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A modified Qian-Liu constitutive model based on advanced pa..:
He, Tao
;
Zhang, Zhao
;
Wang, Shizhao
..
Materials Science in Semiconductor Processing. 176 (2024) - p. 108340 , 2024
Link:
https://doi.org/10.1016/j.mssp.2024.108340
RT Journal T1 <Title>A modified Qian-Liu constitutive model based on advanced packaging underfill materials</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mssp.2024.108340&Exemplar=1&LAN=DE A1 He, Tao A1 Zhang, Zhao A1 Wang, Shizhao A1 Dong, Fang A1 Liu, Sheng PB Elsevier BV YR 2024 SN 1369-8001 JF Materials Science in Semiconductor Processing VO 176 SP 108340 LK http://dx.doi.org/https://doi.org/10.1016/j.mssp.2024.108340 DO https://doi.org/10.1016/j.mssp.2024.108340 SF ELIB - SuUB Bremen
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