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1 Ergebnisse
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Continuously thermal conductive pathway of bidisperse boron..:
Kim, Jun Min
;
Jung, Dae-Woong
;
Kim, Lee Su
...
Materials Today Communications. 27 (2021) - p. 102230 , 2021
Link:
https://doi.org/10.1016/j.mtcomm.2021.102230
RT Journal T1
Continuously thermal conductive pathway of bidisperse boron nitride fillers in epoxy composite for highly efficient heat dissipation
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mtcomm.2021.102230&Exemplar=1&LAN=DE A1 Kim, Jun Min A1 Jung, Dae-Woong A1 Kim, Lee Su A1 Kim, Myungsu A1 Jeong, Sooyeol A1 Lee, SangGap A1 Chang, Sung-Jin A1 Cho, Jung Young A1 Kim, Sun Ha A1 Park, Joon Yong A1 Choi, Kyuseok A1 Yi, Gi-Ra A1 Nam, Ki Min A1 Lee, Gaehang PB Elsevier BV YR 2021 SN 2352-4928 JF Materials Today Communications VO 27 SP 102230 LK http://dx.doi.org/https://doi.org/10.1016/j.mtcomm.2021.102230 DO https://doi.org/10.1016/j.mtcomm.2021.102230 SF ELIB - SuUB Bremen
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