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1 Ergebnisse
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Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hyb..:
Zhang, Shuai
;
Qiu, Qingyang
;
Ding, Tianran
...
Materials Today Communications. 39 (2024) - p. 108609 , 2024
Link:
https://doi.org/10.1016/j.mtcomm.2024.108609
RT Journal T1
Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.mtcomm.2024.108609&Exemplar=1&LAN=DE A1 Zhang, Shuai A1 Qiu, Qingyang A1 Ding, Tianran A1 Long, Weimin A1 Zhong, Sujuan A1 Paik, Kyung-Wook A1 He, Peng A1 Zhang, Shuye PB Elsevier BV YR 2024 SN 2352-4928 JF Materials Today Communications VO 39 SP 108609 LK http://dx.doi.org/https://doi.org/10.1016/j.mtcomm.2024.108609 DO https://doi.org/10.1016/j.mtcomm.2024.108609 SF ELIB - SuUB Bremen
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