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Formation of subsurface cracks in silicon wafers by grindin:

Yin, Jingfei ; Bai, Qian ; Li, Yinnan.
Nanotechnology and Precision Engineering.  1 (2018)  3 - p. 172-179 , 2018
Link: https://doi.org/10.1016/j.npe.2018.09.003