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1 Ergebnisse
1
High-strength and high-conductivity Cu-Cu bonding fabricate..:
Chen, Nannan
;
Wang, Hongliang
;
Liu, Vic
..
Scripta Materialia. 226 (2023) - p. 115190 , 2023
Link:
https://doi.org/10.1016/j.scriptamat.2022.115190
RT Journal T1
High-strength and high-conductivity Cu-Cu bonding fabricated by resistance micro-welding with amorphous Ni-P coatings and multi-pulse discharging
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.scriptamat.2022.115190&Exemplar=1&LAN=DE A1 Chen, Nannan A1 Wang, Hongliang A1 Liu, Vic A1 Pan, Bo A1 Li, Jingjing PB Elsevier BV YR 2023 SN 1359-6462 JF Scripta Materialia VO 226 SP 115190 LK http://dx.doi.org/https://doi.org/10.1016/j.scriptamat.2022.115190 DO https://doi.org/10.1016/j.scriptamat.2022.115190 SF ELIB - SuUB Bremen
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