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1 Ergebnisse
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Residual stress analysis of electrodeposited thick CoMnP mo..:
Chen, Yu-Shan
;
Lin, Chiao-Chi
;
Chin, Tsung-Shune
..
Surface and Coatings Technology. 434 (2022) - p. 128169 , 2022
Link:
https://doi.org/10.1016/j.surfcoat.2022.128169
RT Journal T1
Residual stress analysis of electrodeposited thick CoMnP monolayers and CoMnP/Cu multilayers
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.surfcoat.2022.128169&Exemplar=1&LAN=DE A1 Chen, Yu-Shan A1 Lin, Chiao-Chi A1 Chin, Tsung-Shune A1 Chang, Jen-Yuan (James) A1 Sung, Cheng-Kuo PB Elsevier BV YR 2022 SN 0257-8972 JF Surface and Coatings Technology VO 434 SP 128169 LK http://dx.doi.org/https://doi.org/10.1016/j.surfcoat.2022.128169 DO https://doi.org/10.1016/j.surfcoat.2022.128169 SF ELIB - SuUB Bremen
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