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Interfacial debonding in a thin plate bonded to a rigid sub..:
Wu, Jiayu
Theoretical and Applied Fracture Mechanics. 132 (2024) - p. 104468 , 2024
Link:
https://doi.org/10.1016/j.tafmec.2024.104468
RT Journal T1 <Title>Interfacial debonding in a thin plate bonded to a rigid substrate with a circular hole</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.tafmec.2024.104468&Exemplar=1&LAN=DE A1 Wu, Jiayu PB Elsevier BV YR 2024 SN 0167-8442 JF Theoretical and Applied Fracture Mechanics VO 132 SP 104468 LK http://dx.doi.org/https://doi.org/10.1016/j.tafmec.2024.104468 DO https://doi.org/10.1016/j.tafmec.2024.104468 SF ELIB - SuUB Bremen
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