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1 Ergebnisse
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Dual etch processes of via and metal paste filling for thro..:
Ham, Yong-Hyun
;
Kim, Dong-Pyo
;
Park, Kun-Sik
...
Thin Solid Films. 519 (2011) 20 - p. 6727-6731 , 2011
Link:
https://doi.org/10.1016/j.tsf.2011.01.406
RT Journal T1
Dual etch processes of via and metal paste filling for through silicon via process
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.tsf.2011.01.406&Exemplar=1&LAN=DE A1 Ham, Yong-Hyun A1 Kim, Dong-Pyo A1 Park, Kun-Sik A1 Jeong, Ye-Sul A1 Yun, Ho-Jin A1 Baek, Kyu-Ha A1 Kwon, Kwang-Ho A1 Lee, Kijun A1 Do, Lee-Mi PB Elsevier BV YR 2011 SN 0040-6090 JF Thin Solid Films VO 519 IS 20 SP 6727 OP 6731 LK http://dx.doi.org/https://doi.org/10.1016/j.tsf.2011.01.406 DO https://doi.org/10.1016/j.tsf.2011.01.406 SF ELIB - SuUB Bremen
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