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1 Ergebnisse
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3D strain measurement in electronic devices using through-f..:
Kim, Suhyun
;
Jung, Younheum
;
Lee, Sungho
...
Ultramicroscopy. 146 (2014) - p. 1-5 , 2014
Link:
https://doi.org/10.1016/j.ultramic.2014.04.010
RT Journal T1
3D strain measurement in electronic devices using through-focal annular dark-field imaging
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.ultramic.2014.04.010&Exemplar=1&LAN=DE A1 Kim, Suhyun A1 Jung, Younheum A1 Lee, Sungho A1 Jung Kim, Joong A1 Byun, Gwangseon A1 Lee, Sunyoung A1 Lee, Haebum PB Elsevier BV YR 2014 SN 0304-3991 JF Ultramicroscopy VO 146 SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1016/j.ultramic.2014.04.010 DO https://doi.org/10.1016/j.ultramic.2014.04.010 SF ELIB - SuUB Bremen
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