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Etching characteristics of low-k SiCOH thin films under flu..:
Comeaux, Jacob
;
Wirth, William
;
Courville, Justin
...
Vacuum. 202 (2022) - p. 111165 , 2022
Link:
https://doi.org/10.1016/j.vacuum.2022.111165
RT Journal T1
Etching characteristics of low-k SiCOH thin films under fluorocarbon-based plasmas
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_j.vacuum.2022.111165&Exemplar=1&LAN=DE A1 Comeaux, Jacob A1 Wirth, William A1 Courville, Justin A1 Baek, Nam-Wuk A1 Jung, Donggeun A1 Jang, Seonhee PB Elsevier BV YR 2022 SN 0042-207X JF Vacuum VO 202 SP 111165 LK http://dx.doi.org/https://doi.org/10.1016/j.vacuum.2022.111165 DO https://doi.org/10.1016/j.vacuum.2022.111165 SF ELIB - SuUB Bremen
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