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Modeling of thermal stresses in a graded Cu/W joint:
Chapa, J.
;
Reimanis, I.
Journal of Nuclear Materials. 303 (2002) 2-3 - p. 131-136 , 2002
Link:
https://doi.org/10.1016/s0022-3115(02)00820-6
RT Journal T1 <Title>Modeling of thermal stresses in a graded Cu/W joint</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_s0022-3115(02)00820-6&Exemplar=1&LAN=DE A1 Chapa, J. A1 Reimanis, I. PB Elsevier BV YR 2002 SN 0022-3115 JF Journal of Nuclear Materials VO 303 IS 2-3 SP 131 OP 136 LK http://dx.doi.org/https://doi.org/10.1016/s0022-3115(02)00820-6 DO https://doi.org/10.1016/s0022-3115(02)00820-6 SF ELIB - SuUB Bremen
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