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Mechanical characterization of Sn–Ag-based lead-free solder:
Amagai, Masazumi
;
Watanabe, Masako
;
Omiya, Masaki
..
Microelectronics Reliability. 42 (2002) 6 - p. 951-966 , 2002
Link:
https://doi.org/10.1016/s0026-2714(02)00017-3
RT Journal T1
Mechanical characterization of Sn–Ag-based lead-free solders
UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_s0026-2714(02)00017-3&Exemplar=1&LAN=DE A1 Amagai, Masazumi A1 Watanabe, Masako A1 Omiya, Masaki A1 Kishimoto, Kikuo A1 Shibuya, Toshikazu PB Elsevier BV YR 2002 SN 0026-2714 JF Microelectronics Reliability VO 42 IS 6 SP 951 OP 966 LK http://dx.doi.org/https://doi.org/10.1016/s0026-2714(02)00017-3 DO https://doi.org/10.1016/s0026-2714(02)00017-3 SF ELIB - SuUB Bremen
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