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The effect of the T-stress on crack path selection in adhes..:
Chen, Buo
;
Dillard, David A.
International Journal of Adhesion and Adhesives. 21 (2001) 5 - p. 357-368 , 2001
Link:
https://doi.org/10.1016/s0143-7496(01)00011-2
RT Journal T1 <Title>The effect of the T-stress on crack path selection in adhesively bonded joints</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_s0143-7496(01)00011-2&Exemplar=1&LAN=DE A1 Chen, Buo A1 Dillard, David A. PB Elsevier BV YR 2001 SN 0143-7496 JF International Journal of Adhesion and Adhesives VO 21 IS 5 SP 357 OP 368 LK http://dx.doi.org/https://doi.org/10.1016/s0143-7496(01)00011-2 DO https://doi.org/10.1016/s0143-7496(01)00011-2 SF ELIB - SuUB Bremen
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