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Preparation of SiCp/A356 electronic packaging materials and..:
WANG, Kai-kun
;
KANG, Yong-lin
;
SONG, Pu-guang
..
Transactions of Nonferrous Metals Society of China. 20 (2010) - p. s988-s992 , 2010
Link:
https://doi.org/10.1016/s1003-6326(10)60618-8
RT Journal T1 <Title>Preparation of SiCp/A356 electronic packaging materials and its thixo-forging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_s1003-6326(10)60618-8&Exemplar=1&LAN=DE A1 WANG, Kai-kun A1 KANG, Yong-lin A1 SONG, Pu-guang A1 XU, Feng A1 LI, Xian-hui PB Elsevier BV YR 2010 SN 1003-6326 JF Transactions of Nonferrous Metals Society of China VO 20 SP s988 OP s992 LK http://dx.doi.org/https://doi.org/10.1016/s1003-6326(10)60618-8 DO https://doi.org/10.1016/s1003-6326(10)60618-8 SF ELIB - SuUB Bremen
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