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Growth of CuI buffer layer prepared by spraying method:
YAN, You-hua
;
LIU, Ying-chun
;
FANG, Ling
...
Transactions of Nonferrous Metals Society of China. 21 (2011) 2 - p. 359-363 , 2011
Link:
https://doi.org/10.1016/s1003-6326(11)60722-x
RT Journal T1 <Title>Growth of CuI buffer layer prepared by spraying method</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_s1003-6326(11)60722-x&Exemplar=1&LAN=DE A1 YAN, You-hua A1 LIU, Ying-chun A1 FANG, Ling A1 LU, Zhi-chao A1 LI, Zheng-bang A1 ZHOU, Shao-xiong PB Elsevier BV YR 2011 SN 1003-6326 JF Transactions of Nonferrous Metals Society of China VO 21 IS 2 SP 359 OP 363 LK http://dx.doi.org/https://doi.org/10.1016/s1003-6326(11)60722-x DO https://doi.org/10.1016/s1003-6326(11)60722-x SF ELIB - SuUB Bremen
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