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1 Ergebnisse
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Nanogrinding of SiC wafers with high flatness and low subsu..:
HUO, Feng-wei
;
GUO, Dong-ming
;
KANG, Ren-ke
.
Transactions of Nonferrous Metals Society of China. 22 (2012) 12 - p. 3027-3033 , 2012
Link:
https://doi.org/10.1016/s1003-6326(11)61566-5
RT Journal T1 <Title>Nanogrinding of SiC wafers with high flatness and low subsurface damage</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_s1003-6326(11)61566-5&Exemplar=1&LAN=DE A1 HUO, Feng-wei A1 GUO, Dong-ming A1 KANG, Ren-ke A1 FENG, Guang PB Elsevier BV YR 2012 SN 1003-6326 JF Transactions of Nonferrous Metals Society of China VO 22 IS 12 SP 3027 OP 3033 LK http://dx.doi.org/https://doi.org/10.1016/s1003-6326(11)61566-5 DO https://doi.org/10.1016/s1003-6326(11)61566-5 SF ELIB - SuUB Bremen
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