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1 Ergebnisse
1
Microstructure and properties of electronic packaging box w..:
JIA, Qi-jin
;
LIU, Jun-you
;
LI, Yan-xia
.
Transactions of Nonferrous Metals Society of China. 23 (2013) 1 - p. 80-85 , 2013
Link:
https://doi.org/10.1016/s1003-6326(13)62432-2
RT Journal T1 <Title>Microstructure and properties of electronic packaging box with high silicon aluminum-base alloy by semi-solid thixoforming</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_s1003-6326(13)62432-2&Exemplar=1&LAN=DE A1 JIA, Qi-jin A1 LIU, Jun-you A1 LI, Yan-xia A1 WANG, Wen-shao PB Elsevier BV YR 2013 SN 1003-6326 JF Transactions of Nonferrous Metals Society of China VO 23 IS 1 SP 80 OP 85 LK http://dx.doi.org/https://doi.org/10.1016/s1003-6326(13)62432-2 DO https://doi.org/10.1016/s1003-6326(13)62432-2 SF ELIB - SuUB Bremen
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