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1 Ergebnisse
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Growth behavior and microstructure of intermetallics at int..:
WEI, Xiao-feng
;
ZHU, Xue-wei
;
WANG, Ri-chu
Transactions of Nonferrous Metals Society of China. 27 (2017) 5 - p. 1199-1205 , 2017
Link:
https://doi.org/10.1016/s1003-6326(17)60139-0
RT Journal T1 <Title>Growth behavior and microstructure of intermetallics at interface of AuSn20 solder and metalized-Ni layer</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_s1003-6326(17)60139-0&Exemplar=1&LAN=DE A1 WEI, Xiao-feng A1 ZHU, Xue-wei A1 WANG, Ri-chu PB Elsevier BV YR 2017 SN 1003-6326 JF Transactions of Nonferrous Metals Society of China VO 27 IS 5 SP 1199 OP 1205 LK http://dx.doi.org/https://doi.org/10.1016/s1003-6326(17)60139-0 DO https://doi.org/10.1016/s1003-6326(17)60139-0 SF ELIB - SuUB Bremen
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