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1 Ergebnisse
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Doubleside polishing—a technology mandatory for 300mm wafer..:
Wenski, G
;
Altmann, T
;
Winkler, W
..
Materials Science in Semiconductor Processing. 5 (2002) 4-5 - p. 375-380 , 2002
Link:
https://doi.org/10.1016/s1369-8001(02)00125-7
RT Journal T1 <Title>Doubleside polishing—a technology mandatory for 300mm wafer manufacturing</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1016_s1369-8001(02)00125-7&Exemplar=1&LAN=DE A1 Wenski, G A1 Altmann, T A1 Winkler, W A1 Heier, G A1 Hölker, G PB Elsevier BV YR 2002 SN 1369-8001 JF Materials Science in Semiconductor Processing VO 5 IS 4-5 SP 375 OP 380 LK http://dx.doi.org/https://doi.org/10.1016/s1369-8001(02)00125-7 DO https://doi.org/10.1016/s1369-8001(02)00125-7 SF ELIB - SuUB Bremen
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