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1 Ergebnisse
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Low-Temperature Edge-Fusing Phenomenon of Silver Microplate..:
Furusawa, Takumi
;
Ando, Rin
;
Daiguji, Hiroaki
...
ACS Applied Electronic Materials. 4 (2022) 11 - p. 5538-5549 , 2022
Link:
https://doi.org/10.1021/acsaelm.2c01146
RT Journal T1
Low-Temperature Edge-Fusing Phenomenon of Silver Microplates and Solution-Processed Low-Resistivity Top-Contact Electrodes
UL https://suche.suub.uni-bremen.de/peid=cr-10.1021_acsaelm.2c01146&Exemplar=1&LAN=DE A1 Furusawa, Takumi A1 Ando, Rin A1 Daiguji, Hiroaki A1 Jang, Jeongmin A1 Funabe, Mikuto A1 Matsui, Jun A1 Ishizaki, Manabu A1 Kurihara, Masato PB American Chemical Society (ACS) YR 2022 SN 2637-6113 SN 2637-6113 JF ACS Applied Electronic Materials VO 4 IS 11 SP 5538 OP 5549 LK http://dx.doi.org/https://doi.org/10.1021/acsaelm.2c01146 DO https://doi.org/10.1021/acsaelm.2c01146 SF ELIB - SuUB Bremen
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