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1 Ergebnisse
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The High-Adhesion Die-Cleaning Tape with Dual-Functional Gr..:
Zhang, Yu
;
Lian, Ziqi
;
Ding, Fei
...
ACS Applied Electronic Materials. 6 (2024) 5 - p. 3545-3553 , 2024
Link:
https://doi.org/10.1021/acsaelm.4c00308
RT Journal T1 <Title>The High-Adhesion Die-Cleaning Tape with Dual-Functional Groups for Die to Wafer (D2W) Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1021_acsaelm.4c00308&Exemplar=1&LAN=DE A1 Zhang, Yu A1 Lian, Ziqi A1 Ding, Fei A1 Zhou, Anqi A1 Jin, Renxi A1 Yang, Yudong A1 Wang, Qidong PB American Chemical Society (ACS) YR 2024 SN 2637-6113 SN 2637-6113 JF ACS Applied Electronic Materials VO 6 IS 5 SP 3545 OP 3553 LK http://dx.doi.org/https://doi.org/10.1021/acsaelm.4c00308 DO https://doi.org/10.1021/acsaelm.4c00308 SF ELIB - SuUB Bremen
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