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1 Ergebnisse
1
Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Stra..:
Kang, Qiushi
;
Wang, Chenxi
;
Zhou, Shicheng
...
ACS Applied Materials & Interfaces. 13 (2021) 32 - p. 38866-38876 , 2021
Link:
https://doi.org/10.1021/acsami.1c09796
RT Journal T1 <Title>Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Strategy for a Memory-Centric Chip Architecture</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1021_acsami.1c09796&Exemplar=1&LAN=DE A1 Kang, Qiushi A1 Wang, Chenxi A1 Zhou, Shicheng A1 Li, Ge A1 Lu, Tian A1 Tian, Yanhong A1 He, Peng PB American Chemical Society (ACS) YR 2021 SN 1944-8244 SN 1944-8252 JF ACS Applied Materials & Interfaces VO 13 IS 32 SP 38866 OP 38876 LK http://dx.doi.org/https://doi.org/10.1021/acsami.1c09796 DO https://doi.org/10.1021/acsami.1c09796 SF ELIB - SuUB Bremen
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