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1 Ergebnisse
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Interplay between Thermal Stress and Interface Binding on F..:
Verma, Divya
;
Kumar, Pawan
;
Mukherjee, Sankha
...
ACS Applied Materials & Interfaces. 14 (2022) 14 - p. 16876-16884 , 2022
Link:
https://doi.org/10.1021/acsami.2c00901
RT Journal T1 <Title>Interplay between Thermal Stress and Interface Binding on Fracture of WS2 Monolayer with Triangular Voids</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1021_acsami.2c00901&Exemplar=1&LAN=DE A1 Verma, Divya A1 Kumar, Pawan A1 Mukherjee, Sankha A1 Thakur, Deepa A1 Singh, Chandra Veer A1 Balakrishnan, Viswanath PB American Chemical Society (ACS) YR 2022 SN 1944-8244 SN 1944-8252 JF ACS Applied Materials & Interfaces VO 14 IS 14 SP 16876 OP 16884 LK http://dx.doi.org/https://doi.org/10.1021/acsami.2c00901 DO https://doi.org/10.1021/acsami.2c00901 SF ELIB - SuUB Bremen
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