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1 Ergebnisse
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A Critical Review of Thermal Boundary Conductance across Wi..:
Feng, Tianli
;
Zhou, Hao
;
Cheng, Zhe
..
ACS Applied Materials & Interfaces. 15 (2023) 25 - p. 29655-29673 , 2023
Link:
https://doi.org/10.1021/acsami.3c02507
RT Journal T1 <Title>A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1021_acsami.3c02507&Exemplar=1&LAN=DE A1 Feng, Tianli A1 Zhou, Hao A1 Cheng, Zhe A1 Larkin, Leighann Sarah A1 Neupane, Mahesh R. PB American Chemical Society (ACS) YR 2023 SN 1944-8244 SN 1944-8252 JF ACS Applied Materials & Interfaces VO 15 IS 25 SP 29655 OP 29673 LK http://dx.doi.org/https://doi.org/10.1021/acsami.3c02507 DO https://doi.org/10.1021/acsami.3c02507 SF ELIB - SuUB Bremen
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