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1 Ergebnisse
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Thermally Activated Defect Engineering for Highly Stable an..:
Kim, Dong-Gyu
;
Lee, Won-Bum
;
Lee, Seunghee
...
ACS Applied Materials & Interfaces. 15 (2023) 30 - p. 36550-36563 , 2023
Link:
https://doi.org/10.1021/acsami.3c06517
RT Journal T1 <Title>Thermally Activated Defect Engineering for Highly Stable and Uniform ALD-Amorphous IGZO TFTs with High-Temperature Compatibility</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1021_acsami.3c06517&Exemplar=1&LAN=DE A1 Kim, Dong-Gyu A1 Lee, Won-Bum A1 Lee, Seunghee A1 Koh, Jihyun A1 Kuh, Bongjin A1 Park, Jin-Seong PB American Chemical Society (ACS) YR 2023 SN 1944-8244 SN 1944-8252 JF ACS Applied Materials & Interfaces VO 15 IS 30 SP 36550 OP 36563 LK http://dx.doi.org/https://doi.org/10.1021/acsami.3c06517 DO https://doi.org/10.1021/acsami.3c06517 SF ELIB - SuUB Bremen
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