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1 Ergebnisse
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Core–Shell Transformation-Imprinted Solder Bumps Enabling L..:
Kaltwasser, Mahsa
;
Schmidt, Udo
;
Biswas, Shantonu
...
ACS Applied Materials & Interfaces. 10 (2018) 47 - p. 40608-40613 , 2018
Link:
https://doi.org/10.1021/acsami.8b12390
RT Journal T1
Core–Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects
UL https://suche.suub.uni-bremen.de/peid=cr-10.1021_acsami.8b12390&Exemplar=1&LAN=DE A1 Kaltwasser, Mahsa A1 Schmidt, Udo A1 Biswas, Shantonu A1 Reiprich, Johannes A1 Schlag, Leslie A1 Isaac, Nishchay Angel A1 Stauden, Thomas A1 Jacobs, Heiko O. PB American Chemical Society (ACS) YR 2018 SN 1944-8244 SN 1944-8252 JF ACS Applied Materials & Interfaces VO 10 IS 47 SP 40608 OP 40613 LK http://dx.doi.org/https://doi.org/10.1021/acsami.8b12390 DO https://doi.org/10.1021/acsami.8b12390 SF ELIB - SuUB Bremen
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