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Ultrahigh Conductivity and Superior Interfacial Adhesion of..:
Kwon, Young-Tae
;
Kim, Yun-Soung
;
Lee, Yongkuk
...
ACS Applied Materials & Interfaces. 10 (2018) 50 - p. 44071-44079 , 2018
Link:
https://doi.org/10.1021/acsami.8b17164
RT Journal T1 <Title>Ultrahigh Conductivity and Superior Interfacial Adhesion of a Nanostructured, Photonic-Sintered Copper Membrane for Printed Flexible Hybrid Electronics</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1021_acsami.8b17164&Exemplar=1&LAN=DE A1 Kwon, Young-Tae A1 Kim, Yun-Soung A1 Lee, Yongkuk A1 Kwon, Shinjae A1 Lim, Minseob A1 Song, Yoseb A1 Choa, Yong-Ho A1 Yeo, Woon-Hong PB American Chemical Society (ACS) YR 2018 SN 1944-8244 SN 1944-8252 JF ACS Applied Materials & Interfaces VO 10 IS 50 SP 44071 OP 44079 LK http://dx.doi.org/https://doi.org/10.1021/acsami.8b17164 DO https://doi.org/10.1021/acsami.8b17164 SF ELIB - SuUB Bremen
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