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1 Ergebnisse
1
Thermal Conductivity, Electrical Resistivity, and Microstru..:
Dong, Lan
;
Wei, Guo
;
Cheng, Tao
...
ACS Applied Materials & Interfaces. 12 (2020) 7 - p. 8886-8896 , 2020
Link:
https://doi.org/10.1021/acsami.9b21182
RT Journal T1 <Title>Thermal Conductivity, Electrical Resistivity, and Microstructure of Cu/W Multilayered Nanofilms</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1021_acsami.9b21182&Exemplar=1&LAN=DE A1 Dong, Lan A1 Wei, Guo A1 Cheng, Tao A1 Tang, Jun A1 Ye, Xiaobin A1 Hong, Mengqing A1 Hu, Lulu A1 Yin, Ran A1 Zhao, Shuqin A1 Cai, Guangxu A1 Shi, Yin A1 Pan, Bicai A1 Jiang, Changzhong A1 Ren, Feng PB American Chemical Society (ACS) YR 2020 SN 1944-8244 SN 1944-8252 JF ACS Applied Materials & Interfaces VO 12 IS 7 SP 8886 OP 8896 LK http://dx.doi.org/https://doi.org/10.1021/acsami.9b21182 DO https://doi.org/10.1021/acsami.9b21182 SF ELIB - SuUB Bremen
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