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1 Ergebnisse
1
Sn-3.0Ag-0.5Cu Solder Enriched with Tb4O7 Nanoparticles for..:
Sharma, Ashutosh
;
Hwang, Seung Jun
;
Jung, Jae Pil
ACS Applied Nano Materials. 7 (2024) 2 - p. 2110-2119 , 2024
Link:
https://doi.org/10.1021/acsanm.3c05434
RT Journal T1
Sn-3.0Ag-0.5Cu Solder Enriched with Tb4O7 Nanoparticles for Mini-Light Emitting Diode Packaging
UL https://suche.suub.uni-bremen.de/peid=cr-10.1021_acsanm.3c05434&Exemplar=1&LAN=DE A1 Sharma, Ashutosh A1 Hwang, Seung Jun A1 Jung, Jae Pil PB American Chemical Society (ACS) YR 2024 SN 2574-0970 SN 2574-0970 JF ACS Applied Nano Materials VO 7 IS 2 SP 2110 OP 2119 LK http://dx.doi.org/https://doi.org/10.1021/acsanm.3c05434 DO https://doi.org/10.1021/acsanm.3c05434 SF ELIB - SuUB Bremen
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