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1 Ergebnisse
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Stabilizing Copper by a Reconstruction-Resistant Atomic Cu–..:
Tan, Xin
;
Sun, Kaian
;
Zhuang, Zewen
...
Journal of the American Chemical Society. 145 (2023) 15 - p. 8656-8664 , 2023
Link:
https://doi.org/10.1021/jacs.3c01638
RT Journal T1 <Title>Stabilizing Copper by a Reconstruction-Resistant Atomic Cu–O–Si Interface for Electrochemical CO2 Reduction</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1021_jacs.3c01638&Exemplar=1&LAN=DE A1 Tan, Xin A1 Sun, Kaian A1 Zhuang, Zewen A1 Hu, Botao A1 Zhang, Yu A1 Liu, Qinggang A1 He, Chang A1 Xu, Zhiyuan A1 Chen, Chang A1 Xiao, Hai A1 Chen, Chen PB American Chemical Society (ACS) YR 2023 SN 0002-7863 SN 1520-5126 JF Journal of the American Chemical Society VO 145 IS 15 SP 8656 OP 8664 LK http://dx.doi.org/https://doi.org/10.1021/jacs.3c01638 DO https://doi.org/10.1021/jacs.3c01638 SF ELIB - SuUB Bremen
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