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1 Ergebnisse
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An ultra-deep TSV technique enabled by the dual catalysis-b..:
Su, Yuwen
;
Ding, Yingtao
;
Xiao, Lei
...
Microsystems & Nanoengineering. 10 (2024) 1 - p. , 2024
Link:
https://doi.org/10.1038/s41378-024-00713-5
RT Journal T1
An ultra-deep TSV technique enabled by the dual catalysis-based electroless plating of combined barrier and seed layers
UL https://suche.suub.uni-bremen.de/peid=cr-10.1038_s41378-024-00713-5&Exemplar=1&LAN=DE A1 Su, Yuwen A1 Ding, Yingtao A1 Xiao, Lei A1 Zhang, Ziyue A1 Yan, Yangyang A1 Liu, Zhifang A1 Chen, Zhiming A1 Xie, Huikai PB Springer Science and Business Media LLC YR 2024 SN 2055-7434 JF Microsystems & Nanoengineering VO 10 IS 1 LK http://dx.doi.org/https://doi.org/10.1038/s41378-024-00713-5 DO https://doi.org/10.1038/s41378-024-00713-5 SF ELIB - SuUB Bremen
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