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1 Ergebnisse
1
Artificial intelligence deep learning for 3D IC reliability..:
Hsu, Po-Ning
;
Shie, Kai-Cheng
;
Chen, Kuan-Peng
...
Scientific Reports. 12 (2022) 1 - p. , 2022
Link:
https://doi.org/10.1038/s41598-022-08179-z
RT Journal T1
Artificial intelligence deep learning for 3D IC reliability prediction
UL https://suche.suub.uni-bremen.de/peid=cr-10.1038_s41598-022-08179-z&Exemplar=1&LAN=DE A1 Hsu, Po-Ning A1 Shie, Kai-Cheng A1 Chen, Kuan-Peng A1 Tu, Jing-Chen A1 Wu, Cheng-Che A1 Tsou, Nien-Ti A1 Lo, Yu-Chieh A1 Chen, Nan-Yow A1 Hsieh, Yong-Fen A1 Wu, Mia A1 Chen, Chih A1 Tu, King-Ning PB Springer Science and Business Media LLC YR 2022 SN 2045-2322 JF Scientific Reports VO 12 IS 1 LK http://dx.doi.org/https://doi.org/10.1038/s41598-022-08179-z DO https://doi.org/10.1038/s41598-022-08179-z SF ELIB - SuUB Bremen
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