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1 Ergebnisse
1
Back side thermal imaging of integrated circuits at high sp..:
Tessier, G.
;
Bardoux, M.
;
Boué, C.
..
Applied Physics Letters. 90 (2007) 17 - p. , 2007
Link:
https://doi.org/10.1063/1.2732179
RT Journal T1
Back side thermal imaging of integrated circuits at high spatial resolution
UL https://suche.suub.uni-bremen.de/peid=cr-10.1063_1.2732179&Exemplar=1&LAN=DE A1 Tessier, G. A1 Bardoux, M. A1 Boué, C. A1 Filloy, C. A1 Fournier, D. PB AIP Publishing YR 2007 SN 0003-6951 SN 1077-3118 JF Applied Physics Letters VO 90 IS 17 LK http://dx.doi.org/https://doi.org/10.1063/1.2732179 DO https://doi.org/10.1063/1.2732179 SF ELIB - SuUB Bremen
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