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1 Ergebnisse
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Temporary bond-debond process for manufacture of flexible e..:
Haq, Jesmin
;
Ageno, Scott
;
Raupp, Gregory B.
..
Journal of Applied Physics. 108 (2010) 11 - p. , 2010
Link:
https://doi.org/10.1063/1.3517145
RT Journal T1
Temporary bond-debond process for manufacture of flexible electronics: Impact of adhesive and carrier properties on performance
UL https://suche.suub.uni-bremen.de/peid=cr-10.1063_1.3517145&Exemplar=1&LAN=DE A1 Haq, Jesmin A1 Ageno, Scott A1 Raupp, Gregory B. A1 Vogt, Bryan D. A1 Loy, Doug PB AIP Publishing YR 2010 SN 0021-8979 SN 1089-7550 JF Journal of Applied Physics VO 108 IS 11 LK http://dx.doi.org/https://doi.org/10.1063/1.3517145 DO https://doi.org/10.1063/1.3517145 SF ELIB - SuUB Bremen
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