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1 Ergebnisse
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Mechanism of plasma-induced damage to low-k SiOCH films dur..:
Takeda, Keigo
;
Miyawaki, Yudai
;
Takashima, Seigo
...
Journal of Applied Physics. 109 (2011) 3 - p. , 2011
Link:
https://doi.org/10.1063/1.3544304
RT Journal T1
Mechanism of plasma-induced damage to low-k SiOCH films during plasma ashing of organic resists
UL https://suche.suub.uni-bremen.de/peid=cr-10.1063_1.3544304&Exemplar=1&LAN=DE A1 Takeda, Keigo A1 Miyawaki, Yudai A1 Takashima, Seigo A1 Fukasawa, Masanaga A1 Oshima, Keiji A1 Nagahata, Kazunori A1 Tatsumi, Tetsuya A1 Hori, Masaru PB AIP Publishing YR 2011 SN 0021-8979 SN 1089-7550 JF Journal of Applied Physics VO 109 IS 3 LK http://dx.doi.org/https://doi.org/10.1063/1.3544304 DO https://doi.org/10.1063/1.3544304 SF ELIB - SuUB Bremen
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