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In-situ measurement of solder joint strength in board-mount..:
Kim, Hyoung Il
;
Tian, Jun
;
Gupta, Vijay
Journal of Adhesion Science and Technology. 27 (2013) 7 - p. 719-730 , 2013
Link:
https://doi.org/10.1080/01694243.2012.705546
RT Journal T1 <Title>In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1080_01694243.2012.705546&Exemplar=1&LAN=DE A1 Kim, Hyoung Il A1 Tian, Jun A1 Gupta, Vijay PB Informa UK Limited YR 2013 SN 0169-4243 SN 1568-5616 JF Journal of Adhesion Science and Technology VO 27 IS 7 SP 719 OP 730 LK http://dx.doi.org/https://doi.org/10.1080/01694243.2012.705546 DO https://doi.org/10.1080/01694243.2012.705546 SF ELIB - SuUB Bremen
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