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A numerical study on stress mitigation in through-thickness..:
Manoj, Ishan
;
Kumar, S.
;
Jain, Atul
Journal of Adhesion Science and Technology. 37 (2023) 24 - p. 3652-3686 , 2023
Link:
https://doi.org/10.1080/01694243.2023.2217674
RT Journal T1 <Title>A numerical study on stress mitigation in through-thickness tailored bi-adhesive single-lap joints</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1080_01694243.2023.2217674&Exemplar=1&LAN=DE A1 Manoj, Ishan A1 Kumar, S. A1 Jain, Atul PB Informa UK Limited YR 2023 SN 0169-4243 SN 1568-5616 JF Journal of Adhesion Science and Technology VO 37 IS 24 SP 3652 OP 3686 LK http://dx.doi.org/https://doi.org/10.1080/01694243.2023.2217674 DO https://doi.org/10.1080/01694243.2023.2217674 SF ELIB - SuUB Bremen
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