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A study of the residual stress behavior of rigid and flexib..:
Wang, Ruikun
;
Qu, Chunyan
;
Wang, Dezhi
...
Journal of Adhesion Science and Technology. 38 (2023) 4 - p. 517-532 , 2023
Link:
https://doi.org/10.1080/01694243.2023.2240550
RT Journal T1 <Title>A study of the residual stress behavior of rigid and flexible epoxy adhesives during thermal cycle aging for electronics packaging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1080_01694243.2023.2240550&Exemplar=1&LAN=DE A1 Wang, Ruikun A1 Qu, Chunyan A1 Wang, Dezhi A1 Zhao, Liwei A1 Fan, Xupeng A1 Sun, Qi A1 Liu, Sihan A1 Tan, Lei A1 Cui, Xianghong A1 Zhang, Shuye A1 Liu, Changwei PB Informa UK Limited YR 2023 SN 0169-4243 SN 1568-5616 JF Journal of Adhesion Science and Technology VO 38 IS 4 SP 517 OP 532 LK http://dx.doi.org/https://doi.org/10.1080/01694243.2023.2240550 DO https://doi.org/10.1080/01694243.2023.2240550 SF ELIB - SuUB Bremen
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