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1 Ergebnisse
1
Interconnect Reliability in Advanced Memory Device Packagin..:
Gan, Chong Leong
;
Huang, Chen-Yu
Journal of Adhesion Science and Technology. , 2024
Link:
https://doi.org/10.1080/01694243.2024.2362904
RT Journal T1
Interconnect Reliability in Advanced Memory Device PackagingInterconnect Reliability in Advanced Memory Device Packaging, ISBN: 978-3-031-26707-9 (Print), 978-3-031-26708-6 (Online)
UL https://suche.suub.uni-bremen.de/peid=cr-10.1080_01694243.2024.2362904&Exemplar=1&LAN=DE A1 Gan, Chong Leong A1 Huang, Chen-Yu PB Informa UK Limited YR 2024 SN 0169-4243 SN 1568-5616 JF Journal of Adhesion Science and Technology SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1080/01694243.2024.2362904 DO https://doi.org/10.1080/01694243.2024.2362904 SF ELIB - SuUB Bremen
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