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1 Ergebnisse
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Failure life prediction and factorial design of lead‐free f..:
Chiu, Chien‐Chia
;
Wu, Chung‐Jung
;
Peng, Chih‐Tang
...
Journal of the Chinese Institute of Engineers. 30 (2007) 3 - p. 481-490 , 2007
Link:
https://doi.org/10.1080/02533839.2007.9671276
RT Journal T1
Failure life prediction and factorial design of lead‐free flip chip package
UL https://suche.suub.uni-bremen.de/peid=cr-10.1080_02533839.2007.9671276&Exemplar=1&LAN=DE A1 Chiu, Chien‐Chia A1 Wu, Chung‐Jung A1 Peng, Chih‐Tang A1 Chiang, Kuo‐Ning A1 Ku, Terry A1 Cheng, Kenny PB Informa UK Limited YR 2007 SN 0253-3839 SN 2158-7299 JF Journal of the Chinese Institute of Engineers VO 30 IS 3 SP 481 OP 490 LK http://dx.doi.org/https://doi.org/10.1080/02533839.2007.9671276 DO https://doi.org/10.1080/02533839.2007.9671276 SF ELIB - SuUB Bremen
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