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1 Ergebnisse
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On the advantages of Bi addition into Sn-Cu-S lead-free sol..:
Huang, Huizhen
;
Zhang, Qinghuan
;
Shuai, Gewang
..
Materials Science and Technology. 37 (2021) 18 - p. 1435-1444 , 2021
Link:
https://doi.org/10.1080/02670836.2021.2013046
RT Journal T1
On the advantages of Bi addition into Sn-Cu-S lead-free solder
UL https://suche.suub.uni-bremen.de/peid=cr-10.1080_02670836.2021.2013046&Exemplar=1&LAN=DE A1 Huang, Huizhen A1 Zhang, Qinghuan A1 Shuai, Gewang A1 Yu, Xinyuan A1 Tian, Tingfang PB SAGE Publications YR 2021 SN 0267-0836 SN 1743-2847 JF Materials Science and Technology VO 37 IS 18 SP 1435 OP 1444 LK http://dx.doi.org/https://doi.org/10.1080/02670836.2021.2013046 DO https://doi.org/10.1080/02670836.2021.2013046 SF ELIB - SuUB Bremen
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