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Reducing exposed copper on annular rings in a PCB factory t..:
Lee, Kuo-Liang
;
Wei, Chun-Chin
;
Lee, Hsu-Hua
Total Quality Management & Business Excellence. 20 (2009) 8 - p. 863-876 , 2009
Link:
https://doi.org/10.1080/14783360903128322
RT Journal T1 <Title>Reducing exposed copper on annular rings in a PCB factory through implementation of a Six Sigma project</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1080_14783360903128322&Exemplar=1&LAN=DE A1 Lee, Kuo-Liang A1 Wei, Chun-Chin A1 Lee, Hsu-Hua PB Informa UK Limited YR 2009 SN 1478-3363 SN 1478-3371 JF Total Quality Management & Business Excellence VO 20 IS 8 SP 863 OP 876 LK http://dx.doi.org/https://doi.org/10.1080/14783360903128322 DO https://doi.org/10.1080/14783360903128322 SF ELIB - SuUB Bremen
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