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1 Ergebnisse
1
Enhancing thermal conductivity and balancing mechanical pro..:
Yang, Tao
;
Leng, Jie
;
Hu, Jiewei
...
Virtual and Physical Prototyping. 18 (2023) 1 - p. , 2023
Link:
https://doi.org/10.1080/17452759.2023.2230215
RT Journal T1
Enhancing thermal conductivity and balancing mechanical properties of 3D-printed iPP/HDPE-based dielectric composites via the introduction of hybrid fillers and tailored crystalline structure
UL https://suche.suub.uni-bremen.de/peid=cr-10.1080_17452759.2023.2230215&Exemplar=1&LAN=DE A1 Yang, Tao A1 Leng, Jie A1 Hu, Jiewei A1 Wang, Pengbo A1 Edeleva, Mariya A1 Cardon, Ludwig A1 Yan, Zheng A1 Wang, Tao A1 Zhang, Jie PB Informa UK Limited YR 2023 SN 1745-2759 SN 1745-2767 JF Virtual and Physical Prototyping VO 18 IS 1 LK http://dx.doi.org/https://doi.org/10.1080/17452759.2023.2230215 DO https://doi.org/10.1080/17452759.2023.2230215 SF ELIB - SuUB Bremen
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