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1 Ergebnisse
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Stress-induced stacking faults in the Cu/Au interface:
Lei, H
;
Tang, Y-J
Journal of Physics: Condensed Matter. 16 (2004) 43 - p. 7823-7828 , 2004
Link:
https://doi.org/10.1088/0953-8984/16/43/021
RT Journal T1 <Title>Stress-induced stacking faults in the Cu/Au interface</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_0953-8984_16_43_021&Exemplar=1&LAN=DE A1 Lei, H A1 Tang, Y-J PB IOP Publishing YR 2004 SN 0953-8984 SN 1361-648X JF Journal of Physics: Condensed Matter VO 16 IS 43 SP 7823 OP 7828 LK http://dx.doi.org/https://doi.org/10.1088/0953-8984/16/43/021 DO https://doi.org/10.1088/0953-8984/16/43/021 SF ELIB - SuUB Bremen
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