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1 Ergebnisse
1
Continuous deep reactive ion etching of tapered via holes f..:
Li, R
;
Lamy, Y
;
Besling, W F A
..
Journal of Micromechanics and Microengineering. 18 (2008) 12 - p. 125023 , 2008
Link:
https://doi.org/10.1088/0960-1317/18/12/125023
RT Journal T1 <Title>Continuous deep reactive ion etching of tapered via holes for three-dimensional integration</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1088_0960-1317_18_12_125023&Exemplar=1&LAN=DE A1 Li, R A1 Lamy, Y A1 Besling, W F A A1 Roozeboom, F A1 Sarro, P M PB IOP Publishing YR 2008 SN 0960-1317 SN 1361-6439 JF Journal of Micromechanics and Microengineering VO 18 IS 12 SP 125023 LK http://dx.doi.org/https://doi.org/10.1088/0960-1317/18/12/125023 DO https://doi.org/10.1088/0960-1317/18/12/125023 SF ELIB - SuUB Bremen
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