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Continuum-based multi-physical analysis and fabrication exp..:

Wang, Di-Bao ; Lee, Yung-Chun ; Hsiao, Fei-Bin..
Journal of Micromechanics and Microengineering.  18 (2008)  3 - p. 035030 , 2008
Link: https://doi.org/10.1088/0960-1317/18/3/035030